Dongguan, China

XiaoGang Yang

This inventor holds 1 USPTO granted patent. Top assignee: Sae Magnetics (h.k.) Limited. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: XiaoGang Yang. Retrieved from https://idiyas.com/inventor/xiaogang-yang-snq13t0a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Innovations of Inventor XiaoGang Yang

Introduction

XiaoGang Yang is a notable inventor based in Dongguan, China. He has made significant contributions to the field of electronics through his innovative patent. His work focuses on enhancing the reliability and performance of solder joints in electronic products.

Latest Patents

XiaoGang Yang holds a patent for a surface treatment method for solder joints. This method employs an alkali buffer solution that is used to dip the solder joint. The alkali buffer solution reacts with the solder joint, yielding a passive layer that prevents further corrosion and dissolution during aqueous cleaning or water dipping. The resultant passive layer not only ensures a good appearance but also provides maximum protection of the solder joint. This innovation enhances the reliability and testability of finished electronic products equipped with the solder joint. He has 1 patent to his name.

Career Highlights

XiaoGang Yang is currently associated with Sae Magnetics (H.K.) Limited, where he applies his expertise in developing advanced electronic solutions. His work has been instrumental in improving the quality and durability of electronic components.

Collaborations

XiaoGang Yang has collaborated with notable colleagues such as Ichiro Yagi and DeFeng Lu. Their combined efforts contribute to the advancement of technology in the electronics sector.

Conclusion

XiaoGang Yang's innovative approach to solder joint treatment exemplifies the importance of research and development in electronics. His contributions significantly enhance the reliability and performance of electronic products.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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