The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Feb. 11, 2019
Applicant:
Sae Magnetics (H.k.) Ltd., Hong Kong, HK;
Inventors:
Masashi Shiraishi, Hong Kong, HK;
Toyotaka Kobayashi, Hong Kong, HK;
Hironobu Hayashi, Hong Kong, HK;
Ichiro Yagi, Hong Kong, HK;
Bing Ma, Hong Kong, HK;
Assignee:
SAE Magnetics (H.K.) Ltd., Hong Kong, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); B81B 7/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0032 (2013.01); B81B 7/02 (2013.01); B81C 1/00269 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/09 (2013.01); B81C 2203/0118 (2013.01);
Abstract
A MEMS package has a MEMS chip, and a package substrate which the MEMS chip is adhered. The MEMS chip has an element substrate which a movable element is formed. The MEMS package has a particle filter formed on the package substrate or the MEMS chip. The particle filter has a pierced-structure, which plural through holes are formed on a base surface by a regular arrangement. Further, in the particle filter, a plane-opening rate is set at least 45%, and a thickness-opening rate is set at least 50%.