Hyun Soo Roh

Title: Hyun Soo Roh: Innovator in CMP Slurry Technology

Introduction

Hyun Soo Roh is a notable inventor based in Uiwang-si, South Korea. He has made significant contributions to the field of chemical mechanical polishing (CMP) with a focus on slurry compositions. With a total of 4 patents to his name, his work has advanced the technology used in semiconductor manufacturing.

Latest Patents

Hyun Soo Roh's latest patents include innovative CMP slurry compositions. One of his patents describes a CMP slurry composition that includes metal oxide particles, a diisocyanate compound, and deionized water. This composition is designed to selectively control the polishing speed of a wafer surface that has both convex and concave portions. It allows for rapid primary and secondary polishing while effectively stopping the polishing of the nitride layer during the secondary process. Another patent focuses on a polishing slurry composition that contains an abrasive, a pH-adjusting agent, a water-soluble thickening agent, and a chelating agent. This chelating agent can be either an acetate or phosphate chelating agent, along with a method for its application.

Career Highlights

Throughout his career, Hyun Soo Roh has worked with prominent companies in the technology sector. He has been associated with Cheil Industries Inc. and Samsung Electronics Co., Ltd., where he has contributed to various projects and innovations in the field of semiconductor technology.

Collaborations

Hyun Soo Roh has collaborated with several professionals in his field, including Tae Won Park and In Kyung Lee. These collaborations have likely enhanced his research and development efforts, leading to the successful patents he holds today.

Conclusion

Hyun Soo Roh is a distinguished inventor whose work in CMP slurry technology has made a significant impact on the semiconductor industry. His innovative patents and collaborations reflect his commitment to advancing technology in this critical field.