The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Aug. 06, 2002
Jae Seok Lee, Uiwang-Shi, KR;
Won Joong DO, Uiwang-Shi, KR;
Hyun Soo Roh, Gunpo-Shi, KR;
Kil Sung Lee, Kwachon-Shi, KR;
Jong Won Lee, Seongnam-Shi, KR;
BO Un Yoon, Seongnam-Shi, KR;
Sang Rok Hah, Seoul, KR;
Joon Sang Park, Seoul, KR;
Chang Ki Hong, Gyeonggi-Do, KR;
Jae Seok Lee, Uiwang-Shi, KR;
Won Joong Do, Uiwang-Shi, KR;
Hyun Soo Roh, Gunpo-Shi, KR;
Kil Sung Lee, Kwachon-Shi, KR;
Jong Won Lee, Seongnam-Shi, KR;
Bo Un Yoon, Seongnam-Shi, KR;
Sang Rok Hah, Seoul, KR;
Joon Sang Park, Seoul, KR;
Chang Ki Hong, Gyeonggi-Do, KR;
Cheil Industries, Inc., Kumi-Shi, KR;
Samsung Electronics Co., Ltd., Suwon-Shi, KR;
Abstract
Disclosed herein are slurry compositions for use in CMP(chemical mechanical polishing) process of metal wiring in manufacturing semiconductor devices, comprising a peroxide, an inorganic acid, a propylenediaminetetraacetate(PDTA)-metal complex, a carboxylic acid, a metal oxide powder, and de-ionized water, wherein the PDTA-metal complex plays a major role in improving overall polishing performance and reproducibility thereof by preventing abraded tungsten oxide from readhesion onto the polished surface, as well as in improving the dispersion stability of the slurry composition.