The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2009
Filed:
Jul. 30, 2003
Hyun Soo Roh, Kyoungi-Do, KR;
Tae Won Park, Kyoungi-Do, KR;
Kill Sung Lee, Kyoungi-Do, KR;
IN Kyung Lee, Kyoungi-Do, KR;
Hyun Soo Roh, Kyoungi-Do, KR;
Tae Won Park, Kyoungi-Do, KR;
Kill Sung Lee, Kyoungi-Do, KR;
In Kyung Lee, Kyoungi-Do, KR;
Cheil Industries, Inc., Gyeongsangbuk-Do, KR;
Abstract
Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of ammonia; 0.2˜1 weight % of a hydroxyalkycellulose-based polymer for modifying rheology of the composition; 0.03˜0.5 weight % of a polyoxyethylenealkylamine ether-based nonionic surfactant; 0.01˜1 weight % of a quaternary ammonium base and the balance of deionized water.