The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Dec. 19, 2012
Applicant:
Cheil Industries Inc., Gumi-si, KR;
Inventors:
Hyun Soo Roh, Uiwang-si, KR;
Dong Jin Kim, Uiwang-si, KR;
Yong Soon Park, Uiwang-si, KR;
Yong Kuk Kim, Uiwang-si, KR;
Young Chul Jung, Uiwang-si, KR;
Assignee:
Cheil Industries Inc., Gumi-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C09G 1/02 (2006.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); C09K 3/1463 (2013.01);
Abstract
A CMP slurry composition includes metal oxide particles, a diisocyanate compound, and deionized water. The CMP slurry composition is capable of selectively controlling polishing speed of a wafer surface having a convex portion and a concave portion, such that primary polishing and secondary polishing can be performed rapidly while stopping polishing of the nitride layer upon the secondary polishing.