Hyun Kee Lee

Title: Hyun Kee Lee: Innovator in Electronic Element Packaging and Inertial Sensors

Introduction

Hyun Kee Lee is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of electronic element packaging and inertial sensors. With a total of 7 patents to his name, Lee continues to push the boundaries of innovation in technology.

Latest Patents

One of his latest patents is an "Electronic element package and method for manufacturing the same." This invention relates to an electronic element package that includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion that bonds the substrate to the cap, and blocking portions located on both sides of the bonding portion. Another notable patent is the "Method of manufacturing inertial sensor." This method involves applying a polymer to a base substrate, patterning the polymer to form an opening part, completing a cap by forming a cavity on the base substrate, and bonding the cap to a device substrate using the polymer.

Career Highlights

Hyun Kee Lee is currently employed at Samsung Electro-Mechanics Co., Ltd., where he applies his expertise in developing advanced electronic components. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Lee has collaborated with notable colleagues such as Sung Cheon Jung and Yoon Shik Hong, contributing to various innovative projects within the company.

Conclusion

Hyun Kee Lee's contributions to the fields of electronic packaging and inertial sensors highlight his role as a key innovator in technology. His patents reflect a commitment to advancing the industry and improving electronic device functionality.