Samsung Electro-mechanics Co., Ltd.

Hyun Kee Lee

Sung Cheon Jung

Sang Kee Yoon

Yoon Shik Hong

Jung Hyun Lee

Joon Seok Kang

Tae Joon Park

Yun Sung Kang

Yeong Gyu Lee

Heung Woo Park

Jeong Suong Yang

Seung Joo Shin

Kwang Su Kim

Jong Hyeong Song

Jeong Il Lee

Pil Joong Kang

Suk Kee Hong

Young Gyu Lee

Hyung Jae Park

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Electronic element package and method for manufacturing the same

Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensorincludes (A) applying a polymerto a base substrate, (B) patterning the polymerso as to form an opening partin the polymer, (C) completing a capby forming a cavityon the base substrateexposed fro the opening partthrough an etching process in a thickness direction, and (D) bonding the capto a device substrateby using a polymer, whereby the polymeris applied to the base substratein a constant thickness D, such that the capmay be easily bonded to the device substrateby using the polymer

Method of manufacturing inertial sensor

An MEMS variable optical attenuator includes a substrate having a planar surface, a micro-electric actuator arranged on the planar surface of the substrate, a pair of coaxially aligned optical waveguides having a receiving end and a transmitting end, respectively, and an optical shutter movable to a predetermined position between the receiving end and the transmitting end of the optical waveguides, and driven by the micro-electric actuator. A surface layer is formed on the optical shutter, has reflectivity less than 80% so as to allow incident light beams to partially transmit thereinto, and further has a sufficient light extinction ratio, thereby extinguishing the partially transmitted light beams therein.

Microelectromechanical systems (MEMS) variable optical attenuator

Disclosed is herein an optical switch, which has advantages of an MEMS optical switch and a waveguide optical switch including a small electric power consumption, an easy packaging process, and a fast switching speed. The optical switch includes an input waveguide connected to an input optical fiber through which an optical signal is inputted, and a plurality of output waveguides connected to a plurality of output optical fibers through which the optical signal is outputted. An actuator is positioned between the input waveguide and the output waveguides, and has an MEMS structure including a fixed part and a moving part connected to the fixed part by a spring to move by a predetermined force. Additionally, a plurality of moving waveguides are assembled with the moving part of the actuator and move in the same direction as the movement of the moving part in such a way that first ends of the moving waveguides correspond in position to the input waveguide, and second ends of the moving waveguides correspond in position to the output waveguides.

Optical switch and method of producing the same

A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a protective mask. The dicing method for a micro electro mechanical system chip, comprising the steps of designing a grid line and wafer pattern on a chip-scale on the non-adhesive surface of a transparent tape as a protective mask (first step); sticking microstructure-protecting membranes on the adhesive surface of the transparent tape (second step); putting the transparent tape on the whole surface of a wafer in a state wherein the grid line designed on the non-adhesive surface of the transparent tape is matched to the dicing line of the wafer (third step); cutting the transparent tape to a size larger than the wafer, mounting the wafer on a guide ring and dicing the wafer (fourth step); and separating the transparent tape from diced chips (fifth step).

Dicing method for micro electro mechnical system chip

Disclosed herein is an optical switch. The optical switch includes an electrostatic actuator and a substrate. The electrostatic actuator includes an electrostatic actuator, the electrostatic actuator comprising, a reciprocating mass located in the center of the electrostatic actuator, first rotating axes located symmetrically at the left and right sides of the reciprocating mass, first rotating masses rotatably connected to the first rotating axes, first rotating springs for supporting the first rotating masses, linear springs connected to the first rotating masses, second rotating masses connected to the linear springs, second rotating springs for supporting the second rotating masses, second rotating axes connected to the second rotating masses, structural anchors at the side ends of the actuator, drive electrodes, and a micro mirror movable by the same displacement as the reciprocating mass.

Optical switch

A variable optical attenuator to provide a new drive mechanism for an actuator, whereby the amount of attenuation does not increase in geometric progression as voltage increases, and an exceptional resolution effect is achieved. The variable optical attenuator comprises a transmission fiber for transmitting beams of light, a reception fiber arranged on the same axis with the transmission fiber and receiving the light beams transmitted by the transmission fiber, a variable shutter arranged between the transmission and reception fibers, and moving vertically to cut off or transmit the light beams, thereby controlling an amount of attenuation, the variable shutter cutting off the light to have a maximum amount of attenuation at an initial position, a comb actuator for driving the variable shutter, and a spring for generating a spring force to return the variable shutter to its initial position, the spring force not being applied in the initial position having the maximum amount of attenuation when a drive voltage of the comb actuator is not applied, and spring force being applied when the variable shutter is driven.

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Suwon, South Korea

Hyun Kee Lee