The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Sep. 22, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Pil Joong Kang, Suwon-si, KR;
Kwang Su Kim, Suwon-si, KR;
Jeong Il Lee, Suwon-si, KR;
Jong Hyeong Song, Suwon-si, KR;
Hyun Kee Lee, Suwon-si, KR;
Yun Sung Kang, Suwon-si, KR;
Seung Joo Shin, Suwon-si, KR;
Jeong Suong Yang, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H03H 9/17 (2006.01); H03H 9/54 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); H03H 9/1014 (2013.01); H03H 9/17 (2013.01); H03H 9/54 (2013.01); H01L 2224/11 (2013.01); H01L 2924/16235 (2013.01);
Abstract
The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.