Hyo Young Kim

Title: Hyo Young Kim: Innovator in Semiconductor Packaging

Introduction

Hyo Young Kim is a notable inventor based in Eumseong, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include a semiconductor package featuring a redistribution structure and a method for manufacturing it. This invention involves a semiconductor package that incorporates a redistribution structure with at least one redistribution insulating layer and one redistribution pattern. The design includes a semiconductor chip positioned on the redistribution structure, along with a molding layer that covers the chip. The redistribution pattern consists of a redistribution via that extends in a first direction perpendicular to the top surface of the structure, and a redistribution line that runs parallel to the top surface. The inner walls of the redistribution via are inclined, and the thickness difference between the central portion and the edge of the redistribution line is maintained between 1% to 10% of the central thickness.

Another significant patent is a chip package with a connection portion that passes through an encapsulation portion. This invention enhances the strength of the package while simplifying the manufacturing process. It improves durability by forming a reinforcing layer on the chip using an adhesive layer, allowing the chip and reinforcing layer to be integrated with the molding layer. Additionally, the package strength is enhanced by incorporating solder balls between a base substrate and a re-wiring layer, which are integrated with the molding layer. A wiring layer can also be formed directly on the molding layer using polyimide, eliminating the need for a separate insulating layer.

Career Highlights

Hyo Young Kim is currently employed at Nepes Co., Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has significantly impacted the efficiency and durability of semiconductor packages.

Collaborations

He collaborates with talented coworkers, including Yongtae Kwon and Eung Ju Lee, who contribute to the innovative environment at Nepes Co., Ltd.

Conclusion

Hyo Young Kim's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.