This inventor holds 5 USPTO granted patents and 14 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hwanjoo Park: Semiconductor Package Inventor
Introduction
Hwanjoo Park is an inventor based in Suwon, South Korea, whose patent work includes semiconductor packaging technology. He is associated with Samsung Electronics Ltd. and has 5 patents.
Latest Patents
Park’s latest listed patent, “Three-Dimensional Semiconductor Package with Package-on-Package Semiconductor Chips,” describes a semiconductor package built from multiple chips and redistribution structures. The design places a first semiconductor package on a first redistribution structure and includes semiconductor chips, a molding member, and a second redistribution structure supporting another semiconductor package. The patent specifies that the second semiconductor chip is horizontally separated from the second package and has an upper surface higher than the molding member.
Career Highlights
Park’s listed patent activity reflects work on three-dimensional semiconductor packaging, including arrangements that integrate multiple semiconductor chips and package layers. His affiliation with Samsung Electronics Ltd. connects this work to the company’s semiconductor technology efforts.
Collaborations
Park’s listed coworkers include Jonggyu Lee and Taehwan Kim.
Conclusion
Hwanjoo Park’s patent portfolio includes semiconductor packaging innovations, with his latest listed patent addressing a three-dimensional package-on-package structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile