Seongnam, South Korea

Hwa Seon Shin

This inventor holds 24 USPTO granted patents and 15 published patent applications, plus 2 CIPO patents, primarily in 3D Printing Technology. Top assignee: Korea Electronics Technology Institute. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hwa Seon Shin. Retrieved from https://idiyas.com/inventor/hwa-seon-shin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 75.0


Average Co-Inventor Count = 4.3

ph-index = 2

Forward Citations = 17(Granted Patents)


Location History:

  • Seongnam, KR (2014)
  • Gyeonggi-do, KR (2013 - 2017)
  • Seongnam-si, KR (2014 - 2017)
  • Yongin-si, KR (2016 - 2023)

Company Filing History:


Years Active: 2013-2026

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Areas of Expertise:
3D Printing
Slicing Method
Design Modification
Output Reliability
Tool Path Regeneration
Support Structure
Quantization Error
Tolerance Problem
Nozzle Clogging
Mesh Surface
Monitoring
Image Segmentation
24 patents (USPTO):Explore Patents

Title: Innovations by Hwa Seon Shin in 3D Printing Technologies

Introduction

Hwa Seon Shin, a notable inventor based in Seongnam-si, South Korea, has made significant contributions to the field of 3D printing with a total of 21 granted patents. His innovative works focus on improving the efficiency and reliability of 3D printing processes, addressing common challenges faced by engineers and manufacturers alike.

Latest Patents

Among Hwa Seon Shin's latest patents are groundbreaking methods that enhance the functionality of 3D printing. One such patent is for a "Method for creating a 2D slicing polyline based support structure for 3D printing." This invention details an efficient process for slicing a 3D model into multiple 2D layers, calculating precise support positions for each layer, and creating supports accordingly. By implementing this method, users can expect stable outputs with reduced need for additional slicing.

Another recent innovation is the "Nozzle clogging defect compensating method for binder jetting stack manufacturing means." This patent describes a comprehensive approach to tackle nozzle clogging defects in binder jetting processes. It outlines a systematic method for identifying defect occurrence regions, determining compensation feasibility, and reflecting this information in the output code. This approach not only ensures cost-effectiveness by minimizing replacement time and costs but also optimizes the production efficiency of the binder jetting type stack manufacturing outputs.

Career Highlights

Hwa Seon Shin is affiliated with the Korea Electronics Technology Institute, a pivotal institution in advancing electronic and technological innovations. His work at the institute positions him at the forefront of research and development in 3D printing technologies, contributing significantly to the scientific community's understanding and application of these innovations.

Collaborations

Throughout his career, Hwa Seon Shin has collaborated with talented individuals such as Byeong Ho Choi and Je Woo Kim. These partnerships have fostered an environment of innovation and creativity, allowing for collaborative problem-solving and the advancement of their shared technological interests.

Conclusion

Hwa Seon Shin represents a remarkable figure in the world of 3D printing innovations. His 21 patents reflect a commitment to enhancing manufacturing processes and solving prevalent challenges in the industry. As technology continues to evolve, inventors like Hwa Seon Shin will undoubtedly pave the way for future advancements in this dynamic field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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