The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Feb. 19, 2020
Applicant:

Korea Electronics Technology Institute, Seongnam-si, KR;

Inventors:

Hwa Seon Shin, Yongin-si, KR;

Hye In Lee, Anyang-si, KR;

Sung Hwan Chun, Seoul, KR;

Sung Hun Park, Seoul, KR;

Ji Min Jang, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/40 (2017.01); B29C 64/386 (2017.01); B33Y 50/00 (2015.01); G05B 19/4099 (2006.01);
U.S. Cl.
CPC ...
B29C 64/386 (2017.08); B29C 64/40 (2017.08); B33Y 50/00 (2014.12); G05B 19/4099 (2013.01); G05B 2219/35134 (2013.01); G05B 2219/49023 (2013.01);
Abstract

Provided is a 3D printing slicing method for solving a quantization error problem. A 3D model slicing method according to an embodiment of the present invention comprises: receiving, as input, data of a 3D model to be three-dimensionally printed; calculating the height of the input 3D model; revising the height of the 3D model on the basis of a result of the calculation; and slicing the 3D model having the revised height. Accordingly, the present invention can easily and reliably solve a slicing quantization error problem even without changing the lamination thickness of a 3D printer.


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