The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Nov. 03, 2021
Korea Electronics Technology Institute, Seongnam-si, KR;
Hwa Seon Shin, Yongin-si, KR;
Hye In Lee, Anyang-si, KR;
Sung Hwan Chun, Seoul, KR;
Sung Hun Park, Seoul, KR;
Korea Electronics Technology Institute, Seongnam-si, KR;
Abstract
Provided are a method and a system for solving a tolerance problem which may occur in a slicing quantization (staircase effect) process of 3D printing which slices a 3D model and laminates layers one by one. According to an embodiment of the present disclosure, a 3D model slicing method includes the steps of: receiving, by a 3D model slicing system, an input of data of a 3D model to 3D print; examining, by the 3D model slicing system, a dimension of a layer thickness of the inputted 3D model; correcting, by the 3D model slicing system, a size of a layer for slicing, based on a result of the examining; and slicing, by the 3D model slicing system, the corrected 3D model. Accordingly, by preserving a dimension within a layer thickness, a problem that a concavo-convex portion is lost in a slicing quantization process of 3D printing according to a slicing position within a layer thickness, and a tolerance occurs is solved.