Location History:
- Hsinchu, TW (2009 - 2010)
- Tainan County, TW (2009 - 2011)
Company Filing History:
4 out of 178 
2 out of 85 Years Active: 2009-2011
Title: Innovations by Inventor Hung Tsun Lin
Introduction
Hung Tsun Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work focuses on improving the efficiency and cost-effectiveness of IC packages.
Latest Patents
One of his latest patents is an IC package that reduces wiring layers on the substrate and its carrier. This innovative design primarily includes a chip, a plurality of electrical connecting components, and a chip carrier. The substrate features a top surface with a die-attaching area for the die-attaching layer. The chip is attached to this area and is electrically connected to the substrate through the electrical components. The bonding wire is bonded to interconnecting fingers on the substrate's top surface, with a portion encapsulated in the die-attaching layer. This design eliminates the need for some conventional wirings or vias, resulting in a simpler substrate structure and reduced costs.
Another significant patent by Hung Tsun Lin is for a stacked chip packaging with a heat sink structure. This design features a leadframe composed of inner leads, outer leads, and a die pad. The die pad is positioned between the inner leads and is vertically distanced from them. An offset chip-stacked structure is fixedly connected to the die pad and electrically linked to the inner leads. The encapsulant covers the stacked structure and the inner leads, while exposing the die pad and bus bar surfaces. This innovative approach enhances the thermal management of stacked chip packages.
Career Highlights
Hung Tsun Lin has worked with prominent companies such as Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has contributed to his expertise in integrated circuit technology.
Collaborations
He has collaborated with notable coworkers, including Yu-Ren Chen and Geng-Shin Shen, further enhancing his innovative capabilities.
Conclusion
Hung Tsun Lin's contributions to integrated circuit packaging demonstrate his commitment to innovation and efficiency. His patents reflect a deep understanding of technology and a drive to improve existing systems. His work continues to influence the field of electronics and integrated circuits.