Company Filing History:
Years Active: 2005-2007
Title: Innovations of Inventor Hung-Min Liu
Introduction
Hung-Min Liu is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on the fabrication of semiconductor integrated circuit chips, which are essential components in modern electronic devices.
Latest Patents
One of his latest patents involves the fabrication of semiconductor integrated circuit chips. This patent describes a semiconductor wafer that includes multiple active circuit die areas, each bordered by a dicing line region. The design allows for mechanical wafer dicing to separate the active circuit die areas. An overcoat covers both the active circuit die areas and the dicing line region, while an inter-layer dielectric layer is positioned underneath the overcoat. Additionally, a reinforcement structure with holes is formed within the dicing line region to enhance the integrity of the chip. Another notable patent is the parasitic capacitance-preventing dummy solder bump structure. This invention includes a conductive layer on a substrate, covered by a dielectric layer, and features an under bump metallurgy layer along with a solder bump. This structure is crucial for minimizing parasitic capacitance in electronic devices.
Career Highlights
Hung-Min Liu has worked with several notable companies in the semiconductor industry, including United Microelectronics Corporation and United Electronics Corporation. His experience in these organizations has contributed to his expertise in semiconductor fabrication and innovation.
Collaborations
Throughout his career, Liu has collaborated with talented individuals such as Kuo-Ming Chen and Jui-Meng Jao. These collaborations have likely enriched his work and led to advancements in semiconductor technology.
Conclusion
Hung-Min Liu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of electronic devices.