Hung-Lien Yeh

Title: Innovations of Inventor Hung-Lien Yeh

Introduction

Hung-Lien Yeh is a prominent inventor based in New Taipei, Taiwan. He has made significant contributions to the field of technology, holding a total of nine patents. His work primarily focuses on methods and materials that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest patents is a method for cutting glass. This innovative method involves providing a glass substrate that includes at least one cutting surface. Micro-fractures are formed on the cutting surface, and a conductivity material is coated on it to create a layer that can absorb laser energy. When irradiated by laser, the glass substrate adjacent to the cutting surface is fused to repair the micro-fractures. Another notable patent involves a housing for electronic devices, which includes a substrate and a composite layer. This composite layer consists of an adhesive layer, an ink layer, and a protective layer, all of which are crucial for the housing's durability and functionality.

Career Highlights

Hung-Lien Yeh has worked with several notable companies, including Hon Hai Precision Industry Co., Ltd. and Miics & Partners (Shenzhen) Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.

Collaborations

He has collaborated with talented individuals such as Feng-Yuen Dai and Jih-Chen Liu, further enhancing his work through shared expertise and insights.

Conclusion

Hung-Lien Yeh's contributions to the field of technology through his patents and collaborations highlight his innovative spirit and dedication to advancing electronic device functionality. His work continues to influence the industry and inspire future innovations.