The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Jun. 28, 2017
Applicant:

Miics & Partners (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Feng-Yuen Dai, New Taipei, TW;

Jih-Chen Liu, New Taipei, TW;

Hung-Lien Yeh, New Taipei, TW;

Bing-Heng Lee, New Taipei, TW;

Chung-Pei Wang, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/08 (2006.01); C03C 17/22 (2006.01); C03C 17/32 (2006.01); C03C 23/00 (2006.01); C03B 29/02 (2006.01);
U.S. Cl.
CPC ...
C03B 33/082 (2013.01); C03B 29/025 (2013.01); C03C 17/22 (2013.01); C03C 17/32 (2013.01); C03C 23/0025 (2013.01); C03C 2218/328 (2013.01); C03C 2218/355 (2013.01);
Abstract

A method for cutting glass is disclosed. A glass substrate is provided, the glass substrate includes at least one cutting surface, some micro-fractures are formed on the cutting surface. A conductivity material is provided and coated on the cutting surface to form a conductivity material layer. The conductivity material layer can absorb laser energy. The conductivity material layer is irradiated by laser. The glass substrate adjoined to the cutting surface is fused to repair the micro-fractures.


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