The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Apr. 22, 2015
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Feng-Yuen Dai, New Taipei, TW;

Jih-Chen Liu, New Taipei, TW;

Hung-Lien Yeh, New Taipei, TW;

Han-Lung Lee, New Taipei, TW;

Shun-Chi Tseng, New Taipei, TW;

Hung-Chun Ma, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 45/27 (2006.01); B29L 9/00 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14336 (2013.01); B29C 45/14065 (2013.01); B29C 35/0888 (2013.01); B29C 45/2708 (2013.01); B29C 2035/0827 (2013.01); B29C 2045/14098 (2013.01); B29C 2045/2714 (2013.01); B29L 2009/005 (2013.01);
Abstract

A device for applying a coating on a component where the component includes an inner surface, an outer surface, and end surfaces. The coating device includes a supporting pedestal, a UV light-transparent cover plate, a first pumping device, and an injecting device. The supporting pedestal is configured for holding the inner surface of the component, the end surfaces and the outer surface are exposed in the forming cavity. A through hole is defined in the center of the pedestal and a forming cavity is defined between the cover plate and the component when the cover plate is placed and secured on the pedestal. The first pumping device applies suction to the through hole to hold the component on the pedestal and the injecting device injects UV light-curable coating material in liquid form into the forming cavity.


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