The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Dec. 24, 2013
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Feng-Yuen Dai, New Taipei, TW;

Hung-Lien Yeh, New Taipei, TW;

Chung-Pei Wang, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/08 (2006.01); C03B 33/07 (2006.01);
U.S. Cl.
CPC ...
C03B 33/082 (2013.01); C03B 33/072 (2013.01);
Abstract

A method for cutting chemically strengthened glass is provided. The chemically strengthened glass includes a first stress layer, a second stress layer, and a tension layer sandwich between the first stress layer and the second stress layer. The method includes: using a green pulsed laser to cut the first stress layer, wherein the green pulsed laser includes a first green pulsed laser having femtosecond level and a second green pulsed laser having nanosecond level; using a ultraviolet pulsed laser to cut the tension layer, wherein the ultraviolet pulsed laser includes a first ultraviolet pulsed laser having femtosecond level and a second ultraviolet pulsed laser having nanosecond level; and using the green pulse layer to cut the second stress layer.


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