The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Apr. 29, 2015
Applicant:

Miics & Partners (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Hung-Chun Ma, New Taipei, TW;

Han-Lung Lee, New Taipei, TW;

Yu-Lin Liao, New Taipei, TW;

Chih-Jung Chang, New Taipei, TW;

Hung-Lien Yeh, New Taipei, TW;

Jih-Chen Liu, New Taipei, TW;

Feng-Yuen Dai, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 5/03 (2006.01); G06F 1/16 (2006.01); H05K 5/00 (2006.01); H04M 1/02 (2006.01); B60R 13/02 (2006.01); H04M 1/04 (2006.01);
U.S. Cl.
CPC ...
H05K 5/03 (2013.01); B60R 13/02 (2013.01); G06F 1/1626 (2013.01); H04M 1/0202 (2013.01); H05K 5/0086 (2013.01); H05K 5/0217 (2013.01); H04M 1/04 (2013.01);
Abstract

A housing for an electronic device in the home or car includes a substrate and a composite layer. The composite layer is formed on a surface of the substrate. The composite layer includes an adhesive layer, an ink layer, and a protective layer. The adhesive layer is fully attached to the surface of the substrate. The ink layer is formed on a surface of the adhesive layer away from the substrate. The protective layer is formed on a surface of the ink layer away from the adhesive layer and the process is completed by half-curing and full curing processes. A method for making the housing also is provided.


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