Hung-Hsien Chang

Title: Innovations of Inventor Hung-Hsien Chang

Introduction

Hung-Hsien Chang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of substrate structures and electronic packaging. With a total of 3 patents, his work has advanced the technology used in electronic devices.

Latest Patents

One of his latest patents is titled "Substrate Structure." This invention provides a substrate structure that includes a substrate body with a conductive contact, an insulating layer formed on the substrate body, and an insulating protection layer with openings to dissipate residual stresses during high-temperature manufacturing processes. Another significant patent is "Packaging Substrate and Electronic Package Having the Same." This patent describes a packaging substrate that prevents warping by incorporating a material layer on a specific region of the substrate body, which is crucial for maintaining the integrity of electronic packages.

Career Highlights

Hung-Hsien Chang is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to focus on innovative solutions in the electronics sector. His patents reflect his commitment to improving the performance and reliability of electronic components.

Collaborations

He has collaborated with notable coworkers such as Fang-Yu Liang and Yi-Che Lai, contributing to a dynamic team that drives innovation in their field.

Conclusion

Hung-Hsien Chang's contributions to substrate structures and electronic packaging demonstrate his expertise and dedication to advancing technology. His patents are a testament to his innovative spirit and impact on the electronics industry.