The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
Mar. 08, 2016
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Fang-Yu Liang, Taichung, TW;
Hung-Hsien Chang, Taichung, TW;
Yi-Che Lai, Taichung, TW;
Chang-Fu Lin, Taichung, TW;
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/16 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/486 (2013.01); H01L 23/16 (2013.01); H01L 23/49827 (2013.01); H01L 23/145 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/35121 (2013.01); H01L 2924/37001 (2013.01);
Abstract
A packaging substrate is provided, which includes: a substrate body having a first region with a plurality of conductive pads and a second region adjacent to the first region, and a material layer formed on the second region to prevent the substrate body from warping. An electronic package having the packaging substrate is also provided.