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For the Inventor, By the Inventor

Taichung, Taiwan

Hung-Chia Tsai

USPTO Granted Patents = 18

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 100(Granted Patents)


Company Filing History:

goldMedal18 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2021

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18 patents (USPTO):Explore Patents
1. 11117796 - MEMS devices including MEMS dies and connectors thereto (2021-09-14),
2. 11014805 - Method of forming semiconductor package and semiconductor package (2021-05-25),
3. 10710871 - MEMS devices including MEMS dies and connectors thereto (2020-07-14),
4. 10508023 - MEMS devices including MEMS dies and connectors thereto (2019-12-17),
5. 10384933 - Method of forming micro electromechanical system sensor (2019-08-20),
6. 10155659 - Vacuum sealed MEMS and CMOS package (2018-12-18),
7. 9919914 - MEMS devices including MEMS dies and connectors thereto (2018-03-20),
8. 9776856 - Vacuum sealed MEMS and CMOS package (2017-10-03),
9. 9725310 - Micro electromechanical system sensor and method of forming the same (2017-08-08),
10. 9617143 - Semiconductor device (2017-04-11),
11. 9469524 - Semiconductor device with through molding vias and method of making the same (2016-10-18),
12. 9422153 - Support structure for TSV in MEMS structure (2016-08-23),
13. 9403674 - Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs) (2016-08-02),
14. 9352956 - MEMS devices and methods for forming same (2016-05-31),
15. 9315378 - Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using wire bonding (2016-04-19),

Title: The Innovative Mind of Hung-Chia Tsai

Introduction

Hung-Chia Tsai is a prominent inventor based in Taichung, Taiwan. With an impressive portfolio of 18 patents, he has made significant contributions to the field of semiconductor technology. His inventions, particularly in MEMS (Micro-Electro-Mechanical Systems), have positioned him as a key innovator in the industry.

Latest Patents

Among his latest innovations is a groundbreaking MEMS device that incorporates two MEMS dies. This device features a first MEMS die with a cavity maintained at a specific pressure, while a second MEMS die operates at a different pressure. The inventive aspect lies in a unique molding material that surrounds both dies, along with a series of electrical connectors that enhance the device's functionality. Additionally, Tsai has developed a new method for forming semiconductor packages, which involves bonding a carrier to a substrate surface, allowing for efficient and effective integration of active circuit wafers.

Career Highlights

Hung-Chia Tsai currently works at Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor manufacturing field. Throughout his career, he has focused on pushing the boundaries of what is possible in semiconductor design and fabrication, resulting in a substantial number of patents that underline his expertise and innovative spirit.

Collaborations

In his journey as an inventor, Tsai has had the opportunity to collaborate with esteemed colleagues, including Chun-Wen Cheng and Yi-Chuan Teng. These partnerships have facilitated a dynamic exchange of ideas and fostered innovation within their projects, significantly contributing to the development of advanced semiconductor technologies.

Conclusion

Hung-Chia Tsai's work exemplifies the essence of innovation in the semiconductor sector. His patents not only reflect his creativity and technical prowess but also pave the way for future advancements in MEMS devices and semiconductor packaging. As the industry continues to evolve, Tsai’s contributions will surely remain influential.

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