IDiyas

For the Inventor, By the Inventor

Hsinchu, Taiwan

Hui-Yu Lee

USPTO Granted Patents = 19

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 30(Granted Patents)


Company Filing History:

goldMedal19 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2025

where 'Filed Patents' based on already Granted Patents

19 patents (USPTO):
1. 12197123 - Methods for making semiconductor-based integrated circuits (2025-01-14),
2. 12181722 - Structures and process flow for integrated photonic-electric ic package by using polymer waveguide (2024-12-31),
3. 12068269 - Method and system for verifying integrated circuit stack having photonic device (2024-08-20),
4. 12062641 - Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same (2024-08-13),
5. 11852967 - Methods for making semiconductor-based integrated circuits (2023-12-26),
6. 11740415 - Structures and process flow for integrated photonic-electric IC package by using polymer waveguide (2023-08-29),
7. 11670610 - Method and system for verifying integrated circuit stack having photonic device (2023-06-06),
8. 11658157 - Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same (2023-05-23),
9. 11532613 - Structure and method for cooling three-dimensional integrated circuits (2022-12-20),
10. 11043473 - Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same (2021-06-22),
11. 10910365 - Structure and method for cooling three-dimensional integrated circuits (2021-02-02),
12. 10763253 - Structure and method for cooling three-dimensional integrated circuits (2020-09-01),
13. 10634972 - Configurable heating device and method of using the same (2020-04-28),
14. 10535635 - Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor (2020-01-14),
15. 10268788 - Method and system for frequency-aware input/output signal integrity analysis (2019-04-23),

Title: Innovations by Hui-Yu Lee: A Leader in Semiconductor Technology

Introduction

Hui-Yu Lee is a prominent inventor based in Hsinchu, Taiwan, known for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 19 patents, he continues to push the boundaries of innovation in integrated circuits and photonic systems.

Latest Patents

Hui-Yu Lee's recent patents highlight his expertise in semiconductor-based integrated circuit manufacturing and advanced photonic systems. One notable patent entitled "Methods for making semiconductor-based integrated circuits" describes a method for creating integrated circuits by identifying edge elements in a schematic and calculating spatial quantities to ensure layout conformity with specified grid patterns. Another groundbreaking patent, titled "Structures and process flow for integrated photonic-electric IC package by using polymer waveguide," discloses a silicon photonic structure that integrates electrical and photonic integrated circuits. This invention features polymer waveguides designed for optimal signal transmission through innovative layering techniques, enhancing overall performance in photonic applications.

Career Highlights

Hui-Yu Lee works at the Taiwan Semiconductor Manufacturing Company Limited (TSMC), a global leader in semiconductor manufacturing. Throughout his career, Lee has demonstrated a commitment to advancing technology through rigorous research and innovative engineering practices. His patents significantly contribute to the development of state-of-the-art solutions in the semiconductor industry.

Collaborations

Hui-Yu Lee collaborates with esteemed colleagues such as Jui-Feng Kuan and Chih-Lin Chen, working together to drive technological advancements in integrated circuits and photonics. Their collective expertise fosters an environment of creativity and innovation that is essential for success in a rapidly evolving field.

Conclusion

Hui-Yu Lee's contributions to the semiconductor industry and photonics reflect his dedication to innovation and excellence. His numerous patents and collaborative efforts with fellow researchers underscore his significant influence within the technical community. As he continues to pioneer new methods and technologies, Hui-Yu Lee remains a key figure in shaping the future of integrated circuits and photonic systems.

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