Kaohsiung, Taiwan

Hui-Ying Hsieh

USPTO Granted Patents = 10 

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Yanchao Township, Kaohsiung County, TW (2013)
  • Kaohsiung, TW (2014 - 2024)

Company Filing History:


Years Active: 2013-2024

Loading Chart...
10 patents (USPTO):

Title: The Innovative Mind of Hui-Ying Hsieh: Revolutionizing Semiconductor Packaging

Introduction:

Hui-Ying Hsieh, a brilliant inventor based in Kaohsiung, TW, has made significant contributions to the field of semiconductor packaging. With a total of 10 patents under his belt, Hsieh has been at the forefront of developing cutting-edge technologies that are shaping the future of the industry.

Latest Patents:

Two of Hui-Ying Hsieh's groundbreaking patents include the "Semiconductor package structure having a lead frame and a passive component" and the "Semiconductor device package". These patents showcase his expertise in designing innovative semiconductor packaging solutions that optimize performance and efficiency.

Career Highlights:

Hui-Ying Hsieh is a key member of the Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. His work at the company has been instrumental in driving forward advancements in semiconductor packaging technology, solidifying his reputation as a top innovator in the field.

Collaborations:

Throughout his career, Hui-Ying Hsieh has collaborated closely with industry experts such as Chi-Tsung Chiu and Hui Hua Lee. These collaborations have enabled him to exchange ideas, push boundaries, and collectively work towards developing groundbreaking technologies that have a lasting impact on the semiconductor industry.

Conclusion:

In conclusion, Hui-Ying Hsieh stands out as a visionary inventor who continues to push the boundaries of innovation in semiconductor packaging. His work reflects a deep understanding of the industry's complexities and a relentless dedication to designing solutions that drive progress and propel the industry forward. With his exemplary track record and groundbreaking patents, Hsieh remains a driving force in shaping the future of semiconductor technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…