The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2021
Filed:
Oct. 25, 2019
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Chi-Tsung Chiu, Kaohsiung, TW;
Hui-Ying Hsieh, Kaohsiung, TW;
Kuo-Hua Chen, Kaohsiung, TW;
Cheng Yuan Chen, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor package structure includes a base, at least one semiconductor element, a first dielectric layer, a second dielectric layer and a circuit layer. The semiconductor element is disposed on the base and has an upper surface. The first dielectric layer covers at least a portion of a peripheral surface of the semiconductor element and has a top surface. The top surface is non-coplanar with the upper surface of the semiconductor element. The second dielectric layer covers the semiconductor element and the first dielectric layer. The circuit layer extends through the second dielectric layer to electrically connect the semiconductor element.