Company Filing History:
Years Active: 2018-2023
Title: Innovations by Inventor Hui Hua Lee
Introduction
Hui Hua Lee is a prominent inventor based in Kaohsiung, Taiwan. With a remarkable portfolio that includes seven patents, he has made significant contributions to the field of semiconductor technology. His innovative designs and methodologies are paving the way for advances in electronic devices.
Latest Patents
Hui Hua Lee's latest patents focus on semiconductor device packages and manufacturing processes. One of his notable inventions is a semiconductor device package that consists of a first conductive base, accompanied by a first and a second insulation layer. This design features a lateral surface comprising two portions covered by different insulation materials, enhancing the performance and reliability of semiconductor devices.
Another significant patent is the semiconductor package structure, which involves a base material, semiconductor chips, an encapsulant, and a redistribution layer. This innovative package design incorporates a depression structure and conductive vias to electrically connect the semiconductor chip to the redistribution layer, ensuring efficient operation within compact systems.
Career Highlights
Hui Hua Lee currently works at Advanced Semiconductor Engineering, Inc., where he applies his expertise to develop cutting-edge semiconductor technologies. His work at the company reflects his commitment to innovation and excellence in the semiconductor industry.
Collaborations
Throughout his career, Hui Hua Lee has collaborated with talented colleagues, including Chi-Tsung Chiu and Hui-Ying Hsieh. These partnerships underscore the collaborative nature of research and development in the semiconductor field, fostering an environment where innovative ideas can flourish.
Conclusion
Hui Hua Lee's contributions to semiconductor technology through his patents have a profound impact on the industry. His innovative spirit and dedication to advancing technology continue to inspire emerging inventors and reshape the future of electronics.