Hui-Chung Liu

Title: Innovations by Inventor Hui-Chung Liu

Introduction: Hui-Chung Liu, a skilled inventor based in Kaohsiung, Taiwan, has made significant contributions to the field of semiconductor technology. With a total of eight patents to his name, Liu is recognized for his innovative approaches and designs that enhance electronic packaging solutions.

Latest Patents: Liu's recent inventions include an electronic package structure and a semiconductor device package. The electronic package structure features a semiconductor package that comprises a substrate, a first electronic component, and a support component. Notably, the first electronic component is positioned on the substrate, with its backside surface facing the substrate's first surface. The support component bridges the gap between the electronic component and the substrate, ensuring optimal performance. Additionally, his semiconductor device package patent outlines a comprehensive design that includes a carrier, a sensor module, a connector, and a stress buffer structure, creating a robust and efficient assembly for electronic applications.

Career Highlights: Liu's career is marked by his association with Advanced Semiconductor Engineering, Inc., a leading company in semiconductor packaging and testing. His work in this innovative environment has allowed him to advance his research and development in electronic components significantly.

Collaborations: Throughout his career, Liu has collaborated with notable colleagues, including Chi Sheng Tseng and Lu-Ming Lai. Together, they have contributed to pioneering advancements in the semiconductor industry and have helped propel the organization to the forefront of technology.

Conclusion: Hui-Chung Liu stands out as a formidable inventor in the semiconductor field. With eight patents to his credit and a strong professional background within Advanced Semiconductor Engineering, Inc., his contributions continue to shape the future of electronic packaging and semiconductor applications.