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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11817397 B1

PDFFull Text
Date of Patent:
Nov. 14, 2023

Filed:

Dec. 21, 2020

Semiconductor device package

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Chi Sheng Tseng, Kaohsiung, TW;

Lu-Ming Lai, Kaohsiung, TW;

Hui-Chung Liu, Kaohsiung, TW;

Yu-Che Huang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

FOLEY & LARDNER LLP

Primary Examiner:

Robert K Carpenter

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/50 (2006.01); G01L 1/26 (2006.01); H01R 12/61 (2011.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); G01L 1/26 (2013.01); H01L 21/50 (2013.01); H01L 23/5387 (2013.01); H01L 24/80 (2013.01); H01R 12/61 (2013.01); H01L 2021/60135 (2013.01);
Abstract

A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.

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Tseng, Chi. (2023). Semiconductor device package (U.S. Patent No. 11817397). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11817397

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