The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Oct. 19, 2020
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Chi Sheng Tseng, Kaohsiung, TW;
Lu-Ming Lai, Kaohsiung, TW;
Ching-Han Huang, Kaohsiung, TW;
Hui-Chung Liu, Kaohsiung, TW;
Kuo-Hua Lai, Kaohsiung, TW;
Cheng-Ling Huang, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/04 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H03B 5/30 (2006.01); H01L 23/14 (2006.01); B81B 7/00 (2006.01); H03B 5/36 (2006.01); H03L 1/04 (2006.01); H03B 1/02 (2006.01);
U.S. Cl.
CPC ...
H03B 5/04 (2013.01); B81B 7/0077 (2013.01); H01L 23/13 (2013.01); H01L 23/145 (2013.01); H01L 23/36 (2013.01); H01L 24/32 (2013.01); H03B 1/02 (2013.01); H03B 5/30 (2013.01); H03B 5/36 (2013.01); H03L 1/04 (2013.01); B81B 2207/012 (2013.01); H01L 2924/1461 (2013.01);
Abstract
A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.