Company Filing History:
Years Active: 2020-2024
Title: Innovations by Kuo-Hua Lai in Semiconductor Packaging
Introduction
Kuo-Hua Lai, a notable inventor based in Kaohsiung, Taiwan, has made significant contributions to the field of semiconductor packaging. With a portfolio of four patents, he has helped advance the technology in the semiconductor industry, focusing on innovative electronic package structures.
Latest Patents
Among Kuo-Hua Lai's latest patents is an invention titled "Electronic package structure." This patent presents a novel semiconductor package design that includes a substrate and a first electronic component, which is strategically placed on the substrate. The invention further describes a support component located between the backside surface of the first electronic component and the substrate's first surface. Notably, this structure allows a portion of the backside surface to be exposed from the support, enhancing its functionality.
Another recent patent by Kuo-Hua Lai is titled "Semiconductor package structure and method of manufacturing the same." This patent reaffirms his innovative approach by detailing a similar semiconductor package arrangement, emphasizing the importance of the relationship between the first electronic component and its supporting structure.
Career Highlights
Kuo-Hua Lai is currently employed at Advanced Semiconductor Engineering, Inc., a well-regarded company in the semiconductor packaging sector. His role there has allowed him to explore and refine his innovative ideas, contributing to the advancement of technology and product offerings within the company.
Collaborations
Throughout his career, Kuo-Hua Lai has collaborated with peers, including Chi Sheng Tseng and Lu-Ming Lai. These collaborations have fostered an environment of creativity and innovation, leading to the development of cutting-edge semiconductor solutions that benefit the industry.
Conclusion
In summary, Kuo-Hua Lai stands out as a significant figure in semiconductor packaging innovation. With his latest patents and ongoing work at Advanced Semiconductor Engineering, Inc., he continues to influence the future of the semiconductor industry. His inventive spirit exemplifies the essence of innovation, contributing to impactful advancements in technology.