Advanced Semiconductor Engineering, Inc.

Kuo-Hua Lai

Lu-Ming Lai

Ching-Han Huang

Chi Sheng Tseng

Hui-Chung Liu

Cheng-Ling Huang

The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Electronic package structure

Semiconductor package structure and method of manufacturing the same

A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

Semiconductor package structure

Growing community of inventors

Kaohsiung, Taiwan

Kuo-Hua Lai