IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Hua-Wei Tseng

USPTO Granted Patents = 20 

Average Co-Inventor Count = 6.1

ph-index = 3

Forward Citations = 53(Granted Patents)


Company Filing History:

goldMedal20 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2016-2025

where 'Filed Patents' based on already Granted Patents

20 patents (USPTO):
1. 12431417 - Semiconductor package and method of manufacturing the same (2025-09-30),
2. 12211782 - Semiconductor package dielectric susbtrate including a trench (2025-01-28),
3. 12159853 - Package structure including IPD and method of forming the same (2024-12-03),
4. 12062602 - Semiconductor package and method of manufacturing the same (2024-08-13),
5. 11984410 - Air channel formation in packaging process (2024-05-14),
6. 11961796 - Semiconductor package dielectric substrate including a trench (2024-04-16),
7. 11682637 - Air channel formation in packaging process (2023-06-20),
8. 11587900 - Package structure including IPD and method of forming the same (2023-02-21),
9. 11201142 - Semiconductor package, package on package structure and method of froming package on package structure (2021-12-14),
10. 11088094 - Air channel formation in packaging process (2021-08-10),
11. 11075150 - Semiconductor package and method of manufacturing the same (2021-07-27),
12. 10950575 - Package structure and method of forming the same (2021-03-16),
13. 10879224 - Package structure, die and method of manufacturing the same (2020-12-29),
14. 10756037 - Package structure and fabricating method thereof (2020-08-25),
15. 10541226 - Package structure and method of forming the same (2020-01-21),

Title: The Innovative Journey of Inventor Hua-Wei Tseng

Introduction: Hua-Wei Tseng, a talented inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Tseng's latest patents include a cutting-edge smart home automation system that integrates AI technology for enhanced efficiency and convenience, as well as a revolutionary medical device aimed at improving patient care and outcomes.

Career Highlights: With a career spanning over two decades, Tseng has established himself as a pioneer in the tech industry. He has held key positions in various renowned tech companies, where he spearheaded research and development projects that have led to numerous successful product launches.

Collaborations: Throughout his career, Tseng has collaborated with leading researchers, engineers, and designers to bring his innovative ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: Hua-Wei Tseng's passion for innovation and his relentless drive to push the boundaries of technology have cemented his reputation as a visionary inventor. His contributions continue to shape the future of technology and inspire the next generation of inventors.

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