Hua Q Tserng

This inventor holds 24 USPTO granted patents, primarily in Microwave Integrated Circuits. Top assignees: Texas Instruments Corporation, Triquint Semiconductor Corporation. Active years: 1977-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hua Q Tserng. Retrieved from https://idiyas.com/inventor/hua-q-tserng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24

% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 12

Forward Citations = 340(Granted Patents)

Company Filing History:

22 out of 29,888

Texas Instruments Corporation

patents

2 out of 233

Triquint Semiconductor Corporation

patents

Years Active: 1977-2010

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Areas of Expertise:

Microwave Devices

Integrated Circuits

Thermal Impedance

Power Transistors

Heterostructure FET

GaAs Technology

Bipolar Transistors

Microwave Oscillators

Flip-Chip Technology

Avalanche Diode Amplifiers

Transistor Circuits

Millimeter Wave Devices

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7688152 - High frequency stabilization network for microwave devices and monolithic integrated circuits (2010-03-30),

2. 6787826 - Heterostructure field effect transistor (2004-09-07),

3. 6215136 - Integrated circuit capable of low-noise and high-power microwave operation (2001-04-10),

4. 5717231 - Antenna having elements with improved thermal impedance (1998-02-10),

5. 5683919 - Transistor and circuit incorporating same (1997-11-04),

6. 5681766 - Method of making integrated circuit capable of low-noise and high-power (1997-10-28),

7. 5614442 - Method of making flip-chip microwave integrated circuit (1997-03-25),

8. 5612257 - Method of making flip-chip microwave integrated circuit (1997-03-18),

9. 5532506 - Integrated circuit adapted for improved thermal impedance (1996-07-02),

10. 5521406 - Integrated circuit with improved thermal impedance (1996-05-28),

11. 5519358 - Reactively compensated power transistors (1996-05-21),

12. 5512496 - Method of making collector-up bipolar transistor having improved emitter (1996-04-30),

13. 5485025 - Depleted extrinsic emitter of collector-up heterojunction bipolar (1996-01-16),

14. 5469108 - Reactively compensated power transistor circuits (1995-11-21),

15. 5324682 - Method of making an integrated circuit capable of low-noise and (1994-06-28),

Title: Innovator Profile: Hua Q Tserng

Introduction: Hua Q Tserng is an accomplished inventor based in Dallas, TX, known for his significant contributions to the field of microwave devices and integrated circuits. With a remarkable portfolio of 24 patents, Tserng has consistently driven innovation in high-frequency technologies over the years.

Latest Patents: Among his latest inventions, Tserng has developed a high-frequency stabilization network for microwave devices and monolithic integrated circuits. This stabilization network is designed to reduce in-band high-frequency oscillation, effectively addressing issues such as Gunn effect oscillation and IMPATT oscillation. His innovative Heterostructure Field Effect Transistor (HFET) features a high electron mobility transistor built with a substrate and multiple semiconductor layers. The design boasts a transition frequency exceeding 200 GHz, showcasing his dedication to advancing semiconductor technology.

Career Highlights: Throughout his career, Hua Q Tserng has worked with renowned organizations such as Texas Instruments Corporation and Triquint Semiconductor Corporation. His tenure at these companies allowed him to refine his expertise and contribute to influential projects that pushed the boundaries of microwave technology.

Collaborations: Tserng's work has been enriched by collaborations with talented individuals like Paul Saunier and Bumman Kim. These partnerships have fostered an environment of innovation and have played a crucial role in his development as an inventor.

Conclusion: Hua Q Tserng's dedication to innovation and his impressive track record of patents solidify his status as a prominent figure in the field of microwave devices and integrated circuits. His latest advancements hold the potential to impact various applications and showcase the importance of continuous research and development in technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]