Texas Instruments Corporation

Triquint Semiconductor Corporation

Hua Q Tserng

Paul Saunier

Bumman Kim

Hin F Chau

Han-Tzong Yuan

Edward A Beam, Iii

Oren B Kesler

Charles M Rhoads

Larry Charles Witkowski

Ming-Yih Kao

David Michael Fanning

Hung Y Yee

Warren Robert Gaiewski

Robert C Voges

Shashikant M Sanzgiri

A high-frequency stabilization network for microwave devices and monolithic integrated circuits. The stabilization network may comprise one or more monolithic RL parallel networks, configured to reduce in-band high-frequency oscillation, such as Gunn effect oscillation and IMPATT oscillation.

High frequency stabilization network for microwave devices and monolithic integrated circuits

A high electron mobility transistor is constructed with a substrate, a lattice-matching buffer layer formed on the substrate, and a heavily doped p-type barrier layer formed on the buffer layer. A spacer layer is formed on the barrier layer, and a channel layer is formed on the spacer layer. The channel layer may be of uniform composition, or may be made from two or more sublayers. A Schottky layer is formed over the channel layer, and source and drain contacts are formed on the Schottky layer. The substrate may be gallium arsenide, indium phosphide, or other suitable material, and the various semiconductor layers formed over the substrate contain indium. The transistor's transition frequency of the transistor is above 200 GHz.

Heterostructure field effect transistor

Generally, and in one form of the invention, an integrated circuit is disclosed for providing low-noise and high-power microwave operation comprising: an epitaxial material structure comprising a substrate,a low-noise channel layer,a low-noise buffer layer,a power channel layer,and a moderately doped wide bandgap layer,a first active region,comprising a first source contact,above the wide bandgap layer,a first drain contact,above the wide bandgap layer,wherein the first source contact,and the first drain contact,are alloyed and thereby driven into the material structure to make contact with the low-noise channel layer,and a first gate contact,to the low-noise buffer layer,and a second active region,comprising a second source contact,above the wide bandgap layer,a second drain contact,above the wide bandgap layer,wherein the second source contact,and the second drain contact,are alloyed and thereby driven into the material structure to make contact with the power channel layer,and a second gate contact,to the wide bandgap layer,wherein the first active region,and the second active region,are electrically isolated from one another, and whereby the integrated circuit is formed with all epitaxial layers formed during a single epitaxial growth cycle and is capable of providing low-noise, high-power, and switching operation at microwave frequencies.

Integrated circuit capable of low-noise and high-power microwave operation

A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active device have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.

Antenna having elements with improved thermal impedance

A flip-chip integrated circuit having a transistor 300 with terminals 314, 312, 320 contacted from opposite sufaces of a semiconductor substrate 302. The terminals contacted from opposite surfaces of the substrate may be vertically aligned. The active devices may also be etched or implanted to reduce parasitic capacitances and therefore improve transistor performance.

Transistor and circuit incorporating same

Generally, and in one form of the invention, an integrated circuit is disclosed for providing low-noise and high-power microwave operation comprising: an epitaxial material structure comprising a substrate 10, a low-noise channel layer 14, a low-noise buffer layer 16, a power channel layer 18, and a moderately doped wide bandgap layer 20; a first active region 24 comprising a first source contact 32 above the wide bandgap layer 22, a first drain contact 36 above the wide bandgap layer 22, wherein the first source contact 32 and the first drain contact 36 are alloyed and thereby driven into the material structure to make contact with the low-noise channel layer 14, and a first gate contact 28 to the low-noise buffer layer 16; and a second active region 26 comprising a second source contact 34 above the wide bandgap layer 22, a second drain contact 38 above the wide bandgap layer 22, wherein the second source contact 34 and the second drain contact 38 are alloyed and thereby driven into the material structure to make contact with the power channel layer 18, and a second gate contact 30 to the wide bandgap layer 22; wherein the first active region 24 and the second active region 26 are electrically isolated from one another, and whereby the integrated circuit is formed with all epitaxial layers formed during a single epitaxial growth cycle and is capable of providing low-noise, high-power, and switching operation at microwave frequencies.

Method of making integrated circuit capable of low-noise and high-power

A flip-chip integrated circuit 1100 having a transistor 1108 formed at a frontside surface of a substrate 1104. An airbridge 1106 may be formed over portions of the transistor wherein a top surface of the airbridge is spaced from the frontside surface by a distance approximately equal to, or greater than, the thickness of the substrate. The circuit may also include a transmission line 1114 at the frontside surface and a heatsink 1102 coupled to the airbridge.

Method of making flip-chip microwave integrated circuit

A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active devices have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.

Integrated circuit adapted for improved thermal impedance

Integrated circuit with improved thermal impedance

A transistor for amplifying a high-frequency signal comprises multiple unit transistors arranged about a center transmission line 122 and features reactive compensation 140 along the transmission line to provide signals at the output of the unit transistors which generally add in-phase. This has advantages in that a larger or more distributed transistor arrangement than can traditionally be used is made possible without incurring the gain or power degradation associated with the phase differences of signals amplified by unit transistors occurring at distant points along the center transmission line. The reactive compensation includes a capacitor 140 at the end of the transmission line 122 that may be fabricated along with the transistor as a portion of a monolithic integrated circuit.

Reactively compensated power transistors

A collector-up bipolar transistor having an undercut region (522) beneath extrinsic regions of a base layer (510) and an emitter layer (508). The extrinsic emitter region is depleted of charge carriers and provides passivation for the extrinsic portion of the base layer (508). Contact to the emitter layer may be made by forming contacts on the top surface of the substrate (500) or in a recess in the backside of the substrate.

Method of making collector-up bipolar transistor having improved emitter

Depleted extrinsic emitter of collector-up heterojunction bipolar

A circuit for compensating for the phase velocity differences caused by the layout arrangement of a high-frequency transistor circuit comprises a shunt reactive element 60 coupled to an input or output terminal 51 of a first transistor 48 in a sequence of transistors arranged between input 42 and output 54 transmission lines. The shunt reactive element provides adjustment in phase such that signals traversing various routes through the circuit add in phase at the circuit output. The circuit may also include series resonant circuits 102 between the input terminals 44 and 46 of transistors in such a sequence and between output terminals 51 and 52 of transistors in such a sequence. The series resonant circuits appear as short circuits at certain frequencies and thereby may be used to virtually eliminate the phase progression along transmission lines linking transistors in the sequence.

Reactively compensated power transistor circuits

In one form of the invention, an integrated circuit for providing low-noise and high-power microwave operation is disclosed comprising: a) a material structure formed during a single epitaxial growth cycle, said structure comprising: i) a substrate 10; ii) a donor layer 16 above the substrate; iii) a first wide bandgap buffer layer 18 above the donor layer; iv) an undoped first channel layer 19 above the first wide bandgap layer; v) a second channel layer 24 above the first channel layer; and vi) a second wide bandgap layer 26 above the second channel layer; b) a first device 80 fabricated of the material structure comprising: i) a first source contact 50 to said first channel layer; ii) a first drain contact 54 to said first channel layer; and iii) a first gate contact 38 above the first channel layer; and c) a second device 82 fabricated of the material structure comprising: i) a second source contact 52 to said second channel layer; ii) a second drain contact 56 to said second channel layer; and iii) a second gate 46 contacting the second wide band-gap layer.

Growing community of inventors

Dallas, TX, United States of America

Hua Q Tserng