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For the Inventor, By the Inventor

Hsinchu, Taiwan

Hua Feng Chen

This inventor holds 33 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Fabrication. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Coretronic Corporation, Parabellum Strategic Opportunities Fund LLC. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hua Feng Chen. Retrieved from https://idiyas.com/inventor/hua-feng-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 33 

% Patents Active = 87.9

Average Co-Inventor Count = 3.8

ph-index = 5

Forward Citations = 92(Granted Patents)


Company Filing History:

goldMedal29 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 1,255 
 
Coretronic Corporation
 patents
bronzeMedal1 out of 15 
 
Parabellum Strategic Opportunities Fund LLC
 patents
4. 1 out of 1 
 
Parabellum Strategic Opportunties Fund LLC
 patent

Years Active: 2014-2025

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Areas of Expertise:
Semiconductor Device
FinFET Structure
Cobalt Interconnects
Contact Plugs
Dielectric Fins
Integrated Circuit
Source Dislocation
Drain Dislocation
Gate Spacers
Vias
Surface Light Source
Substrate Resistor
33 patents (USPTO):Explore Patents
1. 12469746 - Contact structure of a semiconductor device (2025-11-11),
2. 12464751 - Contact plugs and methods forming same (2025-11-04),
3. 12453164 - Dielectric fins with different dielectric constants and sizes in different regions of a semiconductor device (2025-10-21),
4. 12444649 - Vias for cobalt-based interconnects and methods of fabrication thereof (2025-10-14),
5. 11908735 - Vias for cobalt-based interconnects and methods of fabrication thereof (2024-02-20),
6. 11862708 - Contact plugs and methods forming same (2024-01-02),
7. 11854875 - Contact structure of a semiconductor device (2023-12-26),
8. 11804402 - FinFET structure with controlled air gaps (2023-10-31),
9. 11545390 - Method of fabricating a semiconductor device having a liner layer with a configured profile (2023-01-03),
10. 11404309 - Vias for cobalt-based interconnects and methods of fabrication thereof (2022-08-02),
11. 11282751 - Dielectric fins with different dielectric constants and sizes in different regions of a semiconductor device (2022-03-22),
12. 11251181 - FinFET isolation structure and method for fabricating the same (2022-02-15),
13. 11217477 - Semiconductor device having a liner layer with a configured profile (2022-01-04),
14. 10930752 - Contact plugs and methods forming same (2021-02-23),
15. 10879110 - FinFET structure with controlled air gaps (2020-12-29),

Title: Trailblazer in Innovation: The Inspiring Journey of Inventor Hua Feng Chen

Introduction:

Inventor Hua Feng Chen, based in Hsinchu, Taiwan, is a visionary known for her relentless pursuit of innovation and dedication to pushing technological boundaries. Her remarkable work serves as a source of inspiration for aspiring inventors and a testament to the transformative power of creativity and perseverance.

Latest Patents:

Hua Feng Chen's latest patents include groundbreaking inventions such as "Vias for cobalt-based interconnects and methods of fabrication thereof." This patent showcases her expertise in interconnect structures, featuring cobalt conductive features with advanced barrier layers and via bulk materials like tungsten and cobalt. Another noteworthy invention is the "Contact plugs and methods forming same," which highlights her proficiency in transistor formation and gate stack technology.

Career Highlights:

Throughout her illustrious career, Hua Feng Chen has made significant contributions while working at renowned companies such as Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) and Coretronic Corporation. Her innovative spirit and technical acumen have propelled her to the forefront of the industry, earning her a reputation as a trailblazer in the field of technology.

Collaborations:

Hua Feng Chen has collaborated with esteemed colleagues like Min-Yann Hsieh and Kuo-Hua Pan, who have enriched her projects with their expertise and shared passion for innovation. Together, they have tackled complex technological challenges and brought cutting-edge solutions to fruition, further solidifying Hua Feng Chen's legacy as a pioneering inventor.

Conclusion:

Inventor Hua Feng Chen's unwavering commitment to innovation and her groundbreaking patents underscore her remarkable journey as a trailblazer in the field. Her work continues to inspire and pave the way for future generations of inventors, emphasizing the boundless possibilities that arise from a combination of creativity, perseverance, and a relentless pursuit of excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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