Hsinchu, Taiwan

Hsun-Tien Li


Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 54(Granted Patents)


Company Filing History:


Years Active: 2003-2017

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10 patents (USPTO):

Title: Hsun-Tien Li: Innovator in Organic-Inorganic Hybrid Resins

Introduction

Hsun-Tien Li is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of organic-inorganic hybrid resins. With a total of 10 patents to his name, Li's work has advanced the understanding and application of hybrid materials in various technologies.

Latest Patents

Li's latest patents include an organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same. The organic-inorganic hybrid resin is a reaction product of a composition that includes 0.1-10 parts by weight of reactant (a) and 100 parts by weight of reactant (b). Specifically, reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, which may include titanium, zirconium, zinc, or a combination thereof. Reactant (b) consists of an epoxy resin. Another notable patent involves an organic-inorganic metal oxide hybrid resin, a method for forming the same, and a transparent resin composition derived from it.

Career Highlights

Throughout his career, Hsun-Tien Li has worked with esteemed organizations such as the Industrial Technology Research Institute and Matsushita Electric Works, Ltd. His innovative research and development efforts have positioned him as a key figure in the advancement of hybrid materials.

Collaborations

Li has collaborated with notable colleagues, including Kai-Chi Chen and Shu-Chen Huang, contributing to various projects that enhance the field of materials science.

Conclusion

Hsun-Tien Li's work in organic-inorganic hybrid resins showcases his dedication to innovation and excellence in materials science. His patents reflect a commitment to advancing technology and improving the functionality of materials used in various applications.

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