The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2004
Filed:
Jul. 14, 2003
Kai-Chi Chen, Nantou, TW;
Hsun-Tien Li, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A method of assembling a semiconductor device forming an encapsulant. The method includes providing a substrate having a plurality of semiconductor devices, respectively connecting a semiconductor chip electrically to a predetermined encapsulation area on a surface of the substrate, filling an encapsulant overlying the predetermined encapsulation area using stencil printing, sweeping excess encapsulant over the predetermined encapsulation area at a first air pressure below approximately 1 atm, sweeping encapsulant overlying the predetermined encapsulation area over the encapsulant overlying the predetermined encapsulation area using stencil printing at a second air pressure above the first air pressure, and hardening the encapsulant at a third air pressure above approximately 1 atm.