The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2007
Filed:
Jan. 05, 2004
Kai-chi Chen, Nantou County, TW;
Shu-chen Huang, Keelung, TW;
Hsun-tien LI, Hsinchu, TW;
Tzong-ming Lee, Hsinchu, TW;
Taro Fukui, Osaka, JP;
Tomoaki Nemoto, Osaka, JP;
Kai-Chi Chen, Nantou County, TW;
Shu-Chen Huang, Keelung, TW;
Hsun-Tien Li, Hsinchu, TW;
Tzong-Ming Lee, Hsinchu, TW;
Taro Fukui, Osaka, JP;
Tomoaki Nemoto, Osaka, JP;
Industrial Technology Research Institute, Hsinchu, TW;
Matsushita Electric Works, Ltd., Osaka, JP;
Abstract
A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.