Taro Fukui

Title: Taro Fukui: Innovator in Thermosetting Resin and Chip Package Technology

Introduction

Taro Fukui is a prominent inventor based in Osaka, Japan. He has made significant contributions to the fields of thermosetting resin compositions and chip package structures. With a total of 8 patents to his name, Fukui's work has had a considerable impact on modern technology.

Latest Patents

Fukui's latest patents include a thermosetting resin composition and a method for manufacturing the same. This invention involves a thermosetting resin composition that incorporates a metal filler component, a fluxing component, and a thermosetting resin binder. The metal filler component consists of at least one of bismuth (Bi), indium (In), and tin (Sn). The fluxing component is derived from specific structural formulas that facilitate the coordination with metals.

Another notable patent is related to a chip package structure and the process for fabricating it. This invention outlines a chip package structure that includes a carrier, a chip, and an encapsulating material layer. The process involves connecting chips to a carrier and forming an encapsulating material layer that fills the bonding gap, ensuring effective electrical connections.

Career Highlights

Throughout his career, Taro Fukui has worked with esteemed organizations such as Matsushita Electric Works, Ltd. and the Industrial Technology Research Institute. His experience in these companies has allowed him to refine his skills and contribute to groundbreaking innovations in his field.

Collaborations

Fukui has collaborated with notable colleagues, including Kai-Chi Chen and Shu-Chen Huang. These partnerships have further enhanced his research and development efforts, leading to successful innovations.

Conclusion

Taro Fukui is a distinguished inventor whose work in thermosetting resin and chip package technology has made a lasting impact. His innovative patents and collaborations reflect his commitment to advancing technology in meaningful ways.