Hsuan-Wei Chen

Title: Hsuan-Wei Chen: Innovator in Circuit Technology

Introduction

Hsuan-Wei Chen is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of circuit technology, holding a total of 4 patents. His innovative designs focus on improving the efficiency and functionality of electronic components.

Latest Patents

Among his latest patents is a "Package carrier with improved heat dissipation efficiency and manufacturing method thereof." This invention features a package carrier that includes a circuit structure layer and a heat-conducting element. The circuit structure layer is designed with a notch portion, while the heat-conducting element consists of a first heat-conducting portion and a second heat-conducting portion that are vertically connected. The notch portion exposes the first heat-conducting portion, ensuring optimal alignment with the circuit structure layer.

Another notable patent is for a "Circuit board with a conductive bump mounted on an adhesive layer." This patent outlines a method for manufacturing a circuit board that includes a first conductive layer and an adhesive material that is electrically conductive. The process involves adhering at least one conductive bump to the first conductive layer using the adhesive material, followed by the application of an insulation layer and a second conductive layer.

Career Highlights

Hsuan-Wei Chen is currently employed at Unimicron Technology Corporation, where he continues to develop innovative solutions in circuit technology. His work has significantly impacted the efficiency of electronic devices, making them more reliable and effective.

Collaborations

Hsuan-Wei has collaborated with talented individuals such as Ming-Hao Wu and Chi-Chun Po, who contribute to the innovative environment at Unimicron Technology Corporation.

Conclusion

Hsuan-Wei Chen is a key figure in the advancement of circuit technology, with a focus on improving heat dissipation and manufacturing methods. His contributions through his patents reflect his commitment to innovation in the electronics industry.