The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2020

Filed:

Jan. 10, 2020
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Ra-Min Tain, Hsinchu County, TW;

Pei-Chang Huang, Taoyuan, TW;

Chi-Chun Po, New Taipei, TW;

Chun-Lin Liao, Taoyuan, TW;

Po-Hsiang Wang, New Taipei, TW;

Hsuan-Wei Chen, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/103 (2013.01); H05K 1/111 (2013.01); H05K 2201/0338 (2013.01);
Abstract

A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.


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