logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12156325 B1

PDFFull Text
Date of Patent:
Nov. 26, 2024

Filed:

Dec. 29, 2020

Package carrier with improved heat dissipation efficiency and manufacturing method thereof

Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Ming-Hao Wu, Taoyuan, TW;

Hsuan-Wei Chen, New Taipei, TW;

Chi-Chun Po, New Taipei, TW;

Assignee:

Unimicron Technology Corp., Taoyuan, TW;

Attorney:

JCIPRNET

Primary Examiner:

Monica D Harrison

Assistant Examiner:

Christopher A Culbert

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H05K 1/116 (2013.01); H05K 3/0094 (2013.01); H05K 3/421 (2013.01); H05K 3/429 (2013.01); H05K 3/4679 (2013.01);
Abstract

A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.

Find Patent Forward Citations

Wu, Ming-Hao. (2024). Package carrier with improved heat dissipation efficiency and manufacturing method thereof (U.S. Patent No. 12156325). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12156325

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…