Hsin-Cheng Lai

Title: Hsin-Cheng Lai: Innovator in Semiconductor Technology

Introduction

Hsin-Cheng Lai is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative semiconductor package structures and redistribution layers, which are crucial for modern electronic devices.

Latest Patents

Hsin-Cheng Lai's latest patents include a semiconductor package structure that features a redistribution layer (RDL) structure, a chip, an electronic device, and a stress compensation layer. The RDL structure has a first surface and a second surface opposite to each other. The chip is positioned on the first surface and is electrically connected to the RDL structure. The electronic device is integrated within the RDL structure, electrically connected to the chip, and includes a dielectric layer. The stress compensation layer is strategically placed in or outside the RDL structure. The dielectric layer provides a first stress between 50 Mpa and 200 Mpa in a direction perpendicular to the second surface, while the stress compensation layer offers a second stress in the opposite direction. Importantly, the difference between the first and second stresses does not exceed 60 Mpa.

Another notable patent is for a redistribution structure that includes a first redistribution layer. This layer consists of a dielectric layer and at least one conductive structure located within it. The conductive structure has a specific width, and there is at least one dummy structure adjacent to it, also within the dielectric layer. The gap width between the dummy and conductive structures is defined, and the degree of planarization of the first redistribution layer is greater than or equal to 95%. This innovation is essential for enhancing the performance and reliability of semiconductor devices.

Career Highlights

Hsin-Cheng Lai has worked with esteemed organizations such as the Industrial Technology Research Institute and Taiwan Semiconductor Manufacturing Company Limited. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Some of Hsin-Cheng Lai's notable coworkers include Jui-Wen Yang and Chieh-Wei Feng. Their collaborative efforts have further propelled innovations in the semiconductor field.

Conclusion

Hsin-Cheng Lai is a distinguished inventor whose work in semiconductor technology has led to significant advancements. His patents reflect a deep understanding of the complexities involved in semiconductor packaging