Taipei, Taiwan

Hsien-Ming Lee

This inventor holds 6 USPTO granted patents and 3 published patent applications. Top assignees: Ta Liang Technology Co., Ltd., Academia Sinica, Other. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsien-Ming Lee. Retrieved from https://idiyas.com/inventor/hsien-ming-lee-5qygdfgm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 6 

% Patents Active = 83.3

Average Co-Inventor Count = 5.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Taipei, TW (2022 - 2023)
  • Taoyuan, TW (2022 - 2023)

Company Filing History:


Years Active: 2022-2026

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6 patents (USPTO):Explore Patents

Title: Hsien-Ming Lee: Innovator in Liposome Technology and Polishing Pad Repair

Introduction

Hsien-Ming Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the fields of liposome technology and real-time polishing pad repair. With a total of 6 patents to his name, Lee's work showcases his innovative approach to solving complex problems in these areas.

Latest Patents

One of Lee's latest patents is focused on liposomes and their uses. This patent discloses novel synthetic polypeptides that play a crucial role in the preparation of liposomes. The synthetic polypeptide comprises a membrane lytic motif, a masking motif, and a cleavable linker. When exposed to a stimulus such as light or protease, the linker separates the masking motif from the membrane lytic motif, leading to the collapse of the liposome structure and the release of the encapsulated agent at the target site. This innovation has potential applications in diagnosing and treating diseases.

Another significant patent by Lee is a method for repairing polishing pads in real time. This method includes a trimming step, a detection step, and a reconstruction and analysis step. The surface morphology of the polishing pad is reconstructed through detection, ensuring that the pad can recover its function after trimming. This innovative approach helps reduce costs and enhances the effectiveness of polishing pads.

Career Highlights

Hsien-Ming Lee has worked with Ta Liang Technology Co., Ltd., where he has applied his expertise in developing cutting-edge technologies. His career reflects a commitment to innovation and excellence in his field.

Collaborations

Lee has collaborated with notable individuals such as Chun-Chen Chen and Ching-Tang Hsueh. These collaborations have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Hsien-Ming Lee is a distinguished inventor whose work in liposome technology and polishing pad repair has made a significant impact. His innovative patents demonstrate his ability to address complex challenges in technology and medicine.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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