The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

May. 29, 2020
Applicant:

National Taiwan University of Science and Technology, Taipei, TW;

Inventors:

Chao-Chang Chen, Taipei, TW;

Jen-Chieh Li, Taipei, TW;

Yong-Jie Ciou, Taipei, TW;

Hsien-Ming Lee, Taipei, TW;

Jian-Shian Lin, Taipei, TW;

Chun-Chen Chen, Taipei, TW;

Ching-Tang Hsueh, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 5/28 (2006.01); G01B 5/00 (2006.01); B24B 37/30 (2012.01); B24B 37/005 (2012.01); G01B 5/06 (2006.01);
U.S. Cl.
CPC ...
G01B 5/28 (2013.01); B24B 37/005 (2013.01); B24B 37/30 (2013.01); G01B 5/0004 (2013.01); G01B 5/068 (2013.01);
Abstract

A system and a method for uniformed surface measurement are provided, in which a sensor is provided to perform measurements on a carrier in a polishing machine, and a measuring trajectory of the sensor on the carrier is adjusted by controlling the pivoting of a sensor carrier carrying the sensor and the rotation of a rotating platform in the polishing machine in order to achieve uniformed surface measurements of the carrier and real-time constructions of the surface topography. This allows the polishing state of the carrier to be monitored in real time, thereby improving the efficiency of the polishing process. A sensing apparatus for uniformed surface measurement is also provided.


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