Howard Dang

Title: The Innovations of Howard Dang

Introduction

Howard Dang is a notable inventor based in Milpitas, CA. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work primarily focuses on methods that enhance the efficiency and safety of wafer processing.

Latest Patents

One of Howard's latest patents is titled "Wafer electrical discharge control using argon free dechucking gas." This patent describes a method for dechucking a wafer, which is held onto an electrostatic chuck by an electrostatic charge in a plasma chamber. The process involves removing the electrostatic clamping voltage and introducing an essentially argon-free dechucking gas into the plasma chamber. This innovation allows for the formation of a dechucking plasma, which is crucial for preventing damage to low-k materials during the process.

Another significant patent by Howard is focused on "Preventing damage to low-k materials during resist stripping." This method involves placing a low-k dielectric layer over a substrate and using a patterned photoresist mask. After etching at least one feature into the low-k dielectric layer, a CO conditioning is performed on the feature before stripping the patterned photoresist mask. This approach ensures the integrity of low-k materials during processing.

Career Highlights

Howard is currently employed at Lam Research Corporation, a leading company in the semiconductor equipment industry. His work at Lam Research has allowed him to develop innovative solutions that address critical challenges in wafer processing.

Collaborations

Throughout his career, Howard has collaborated with talented individuals such as Siyi Li and Helen H Zhu. These collaborations have contributed to the advancement of technologies in the semiconductor field.

Conclusion

Howard Dang's contributions to semiconductor technology through his patents and work at Lam Research Corporation highlight his role as an influential inventor. His innovative methods continue to shape the industry and improve wafer processing techniques.