Howard Chin

Title: **The Innovative Mind of Howard Chin**

Introduction

Howard Chin, an accomplished inventor based in Westford, MA, has made significant strides in the field of technology. With a total of three patents to his name, Chin's work focuses predominantly on advancements within multi-chip packages, showcasing his expertise in processor design and thermal management.

Latest Patents

Among Howard Chin's latest innovations is his patent for an "Apparatus and method to provide a thermal parameter report for a multi-chip package." This invention outlines a sophisticated processor design that incorporates at least one core and integrated power management logic. The logic receives temperature data from multiple dies within the processor package, enabling it to determine the smallest temperature control margin. This margin is calculated based on specific thermal control temperatures related to each die and the associated temperature data. Furthermore, the power management logic generates and stores a comprehensive thermal report, enhancing the efficiency of multi-chip packages. Other embodiments detailing various aspects of this innovation are also described.

Career Highlights

Howard Chin is currently associated with Intel Corporation, a leading technology company known for its advancements in semiconductor technology and microprocessor manufacturing. His contributions have played a vital role in improving the design and functionality of processing units.

Collaborations

Throughout his career, Chin has had the opportunity to collaborate with prominent colleagues such as Tessil Thomas and Phani Kumar Kandula. Working alongside other talented engineers and inventors has allowed him to refine his ideas and contribute to groundbreaking technological advancements.

Conclusion

Howard Chin's inventive spirit and dedication to technological innovation continue to propel advancements in the field of multi-chip packaging and processing technology. His patents not only reflect his expertise but also contribute to the ongoing evolution of efficient thermal management in complex electronic systems.