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For the Inventor, By the Inventor

Wuppertal, Germany

Holger Woerner

This inventor holds 26 USPTO granted patents, primarily in Semiconductor Technology. Top assignees: Infineon Technologies Ag, Qimonda Ag, Siemens Aktiengesellschaft. Active years: 2005-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Holger Woerner. Retrieved from https://idiyas.com/inventor/holger-woerner

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 26

% Patents Active = 38.5

Average Co-Inventor Count = 3.9

ph-index = 10

Forward Citations = 445(Granted Patents)


Location History:

  • Regensburg, DE (2005 - 2011)
  • Regengsburg, DE (2014)

Company Filing History:

goldMedal24 out of 15,051 
 
Infineon Technologies Ag
 patents
silverMedal1 out of 555 
 
Qimonda Ag
 patents
bronzeMedal1 out of 30,902 
 
Siemens Aktiengesellschaft
 patents

Years Active: 2005-2014

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Areas of Expertise:
Semiconductor Device
Smart Card
Biosensor
Wiring Substrate
Electronic Module
Plastic Housing
Sensor Component
Device Stack
Production Method
Electromagnetic Shielding
Multichip Module
Thin Semiconductor Chip
26 patents (USPTO):Explore Patents
1. 8659135 - Semiconductor device stack and method for its production (2014-02-25),
2. 7893532 - External contact material for external contacts of a semiconductor device and method of making the same (2011-02-22),
3. 7883993 - Semiconductor device with semiconductor chip and rewiring layer and method for producing the same (2011-02-08),
4. 7772105 - Semiconductor component with plastic housing, and process for producing the same (2010-08-10),
5. 7700956 - Sensor component and panel used for the production thereof (2010-04-20),
6. 7692283 - Device including a housing for a semiconductor chip including leads extending into the housing (2010-04-06),
7. 7638418 - Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same (2009-12-29),
8. 7622733 - Semiconductor structure with a plastic housing and separable carrier plate (2009-11-24),
9. 7575173 - Smart card, smart card module, and a method for production of a smart card module (2009-08-18),
10. 7566968 - Biosensor with smart card configuration (2009-07-28),
11. 7545047 - Semiconductor device with a wiring substrate and method for producing the same (2009-06-09),
12. 7528054 - Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips (2009-05-05),
13. 7524699 - Electronic component and a panel (2009-04-28),
14. 7516543 - Method for manufacturing semiconductor component with a media channel (2009-04-14),
15. 7514273 - Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel (2009-04-07),

Title: Holger Woerner - Innovative Inventor from Wuppertal

Introduction: Holger Woerner is a renowned inventor hailing from Wuppertal, Germany, known for his groundbreaking contributions to various fields of technology and innovation.

Latest Patents: Holger Woerner's latest patents include advancements in renewable energy technologies, smart home systems, and sustainable transportation solutions.

Career Highlights: With a career spanning over two decades, Holger Woerner has established himself as a pioneer in the field of green technologies, with a focus on creating eco-friendly solutions for everyday challenges.

Collaborations: Throughout his career, Holger Woerner has collaborated with leading research institutions, universities, and innovative companies to bring his ideas to life and make a positive impact on the world.

Conclusion: Holger Woerner's passion for innovation and dedication to creating a more sustainable future have solidified his reputation as a visionary inventor in Wuppertal and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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